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Product |
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Platform |
all Brisque platforms |
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Symptoms |
When an expose job using certain screen set parameters is sent to a Lotem 400 or Lotem 800, the number of beams and the throughput are reduced. For example, this occurs when the selected screen set is VC175R10C. |
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Cause |
To prevent plate bending, some separations of the expose job are performed
with a reduced number of beams. This depends on the screen angle and the
screen frequency. |
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Solution |
This variation in number of beams is normal behavior. However, it is helpful to understand when it occurs. The optimization process that is used during an expose is aimed to increase the tolerance of the plate imaging and developing process to variations in the device setup, imaging and chemistry. The overall system tolerance is significantly increased while the overall job preparation time is not affected. However, the optimization process affects the number of beams for specific
plate screening parameters.
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Technical contact(s) |
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Submitted by |
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Date submitted |
02 Feb 2004 |
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