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Thermal 1/1.7 Head Home Page

For product overview, status, and specifications, see the Overview page.

Quick help: Can’t find your favourite links? More...

Config Files are on the Control/Settings page.
Diagnostic Commands are on the Control/settings page.
Error Messages are on the Troubleshooting page.
Firmware NVS Parameters are on the Control/Settings page.
Firmware Releases are on the Downloads page.
Head Part Numbers are on the Parts/Tools page.
Plate Calculators are on the Downloads page.
Theory is on the Reference page.

Product Support News Expand/collapse all news items


TechPlanet DVD Version 7 N.2—10 Jul 2008

24 Jun 2008: Updated: Error message 17657: DTD reset asserted More...

This update helps to clarify how the wrong type of head may cause this error to occur.

Go to the DTD reset asserted document on the Troubleshooting page.

24 Jun 2008: New Artifact: Swaths of missing or corrupted data appear on home or away edges More...

This artifact applies to Trendsetter devices using MPE.

Go to the WJO Artifact document on the Image Artifacts page.

04 Jun 2008: New Troubleshooting item: Spectrum devices with stroke cal and scorr table errors More...

This troubleshooting item applies to errors 17671 and 17732.

Go to the Spectrum devices with stroke cal document on the Troubleshooting page.

01 May 2008: Updated: Photos for thermal head 1.7 More...

New photos are available.

Go to the Drawings/photos page.

23 Apr 2008: Updated: P33 Kodak thermal imaging head More...

The document updates the difference between the P22 and P33 thermal imaging heads.

Go to P33 Kodak Thermal Imaging Head, also available from the P22 and P33 head identification page.

20 Mar 2008: New: TH1.7 Head Connectors More...

The document shows pictures, schematics, and pinouts for a TH1.7 head connection.

Go to the TH1.7 Head Connectors document on the Drawings/Photos page.

TechPlanet DVD Version 7 N.1—20 Mar 2008

15 Feb 2008: Updated: Cleaning the Debris Removal Nozzle More...

The debris removal nozzle cleaning procedure has been revised.

Go to TH1.7 Debris Removal Nozzle Cleaning Procedure, also available from the Procedures page.

25 Jan 2008: Updated: Adjusting Tilt on a Thermal Head More...

The head adjustment to correct tilt has been revised, specifically for TH1.

Go to Adjusting Tilt on a Thermal Head, also available from the Procedures page.

03 Jan 2008: FCO CA13653: Cable connector cover More...

Remove and dispose of the cable cover from the head, because it interferes with the cable assembly.

Go to FCO CA13653. This is a next visit FCO.

05 Dec 2007: Drain the coolant when you upgrade to propylene glycol More...

If you are implementing FCO 12621, make sure that you drain the ethylene glycol from the thermal head before you introduce the new propylene glycol.

Go to FCO CA12621 and Draining the Coolant from a TH1 or TH2 Head.

16 Nov 2007: Updated: Thermal 1.x Head Cables for MPE Devices More...

For Trendsetter VLF platesetters currently using the two power cables 10-3516A and 10-3517A, you must replace these two cables with cable 10-4149A plus the appropriate adapters.

Go to Thermal 1.x head cables for MPE Devices, also available on the Parts/Tools page.

TechPlanet DVD Version 6 N.3—01 Nov 2007

23 Oct 2007: Overview of TH1.X firmware release notes More...

This page provides a summary of the release notes from all recent TH1.X firmware releases. If you are using a firmware build that is not recommended on this page, upgrade to the latest controlled release.

Go to the TH1.X Firmware Release Overview or the Firmware Release page.

16 Oct 2007: Training: Laser safety course available on eCampus More...

The laser safety course Laser Safety: Mastering Light is now available for all Kodak employees.

Go to the Laser Safety page.

04 Oct 2007: Updated: Adjusting Tilt on a Thermal Head More...

The lenticular printing specification of 1.5 microns has been added to this procedure.

Go to Adjusting Tilt on a Thermal Head, also available from the Procedures page.

17 Sep 2007: New location for the TH1.7 ground cable More...

The ground cable has a new location that provides improved grounding for the head.

For full details see the Thermal 1.7 Head Installation Procedure.

17 Sep 2007: Updated: Thermal 1.7 installation procedure More...

Go to the Thermal 1.7 Head Installation Procedure, also available from the Installation page.

28 Aug 2007: Troubleshooting: Irregular artifact lines in the mainscan direction caused by loose ball nut setscrews More...

This new troubleshooting item applies to all CTP output devices.

Go to Irregular artifact lines in the mainscan direction, also available from the Artifact gallery.

09 Jul 2007: Troubleshooting: TH1.7 “head crash” during startup of GMCE output device (GMCE device error #44835) More...

When a GMCE output device with a TH1.7 thermal imaging head is starting up, the following error message may be reported:

*** HEAD CRASH DETECTED ***
C HIM: Fatal head fault occurred: 44835
*** Unsolicited Message 44835 Fatal
[THC:all retries failed on chnl 1]

This message can safely be ignored.

Go to the troubleshooting item on the Base Trendsetter Troubleshooting page.

08 Jun 2007: Avoid excessive humidity to prolong head life More...

With summer almost here, humidity becomes a bigger issue for thermal heads. Excessive humidity shortens the service life of a thermal head, and can also cause stability issues and image artifacts. Make sure that you proactively check the humidity level of every head you work on (use the command >>head status ), and also examine the DHU system to ensure that it has adequate airflow and a clean filter.

Note: If you have to adjust >>set head humidity to keep a customer running, make sure there is follow up scheduled to have the DHU adjusted to bring the humidity back down to the normal range of 5 to 20%.

For full details on how to troubleshoot temperature or humidity errors, see Troubleshooting temperature or humidity errors.

TechPlanet DVD Version 6 N.2—01 Jun 2007

12 Apr 2007: Script index now available for all thermal heads More...

A new document is available that describes the functionality of all available scripts for Thermal 1 (TH1), Thermal 2 (TH2), and Thermal 3 (TH3).

Download the index here: Script Index: TH1, TH2, and TH3. It is also available from the Reference page of this site.

23 Mar 2007: TH1.X Head firmware version 2.01 has been released More...

This firmware release is designed specifically for use with a Magnus 800. Only install this head firmware as part of a controlled release.

For more details see the TH1.X head firmware V2.01 release notes: Thermal 1.X Head Firmware Version 2.01 Release Notes

TechPlanet DVD Version 6 N.1—22 Feb 2007

16 Feb 2007: GMCE Thermal 1.7 field scripts posted More...

Thermal 1.7 field scripts for GMCE are now available. The current field scripts fail on a GMCE device, therefore all devices that have a TH1.x head with GMCE should install this new bundle. The scripts are fully backward compatible, but do not add any features to the existing scripts.

Download the self-extracting zip file here: GMCE Field scripts (TH1/1.7 head), or from the Downloads page.

12 Feb 2007: Cloud or blotch-shaped artifacts appear in solids More...

Swath-bound clouds or blotches and/or tick marks appear on the plate. It can be described at first glance as banding or blotchy solids. It is most visible in solids on devices running at high speeds and with high powers.

For full details on how to troubleshoot this artifact, see Cloud or blotch-shaped artifacts appear in solids.

News archive


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