Error Codes/Messages are on the Troubleshooting page.
Firmware Commands are on the Control/settings page.
Firmware Downloads are on the Downloads page.
Splot Downloads and Procedures are on the Splot site.
Specifications are on the Overview page.
Theory is on the Reference page.

This new procedure provides information about when and how to perform a manual beam correction.

Go to TH2 Manual Beam Correction, also available from the Troubleshooting Procedure page.

TH2 head firmware version 1.09e replaces previous version 1.09c. This patch addresses the issue where the firmware becomes corrupted and a subsystem is not available. In all cases, use 1.09e in place of 1.09c.

Go to Thermal 2 Head Firmware Release Summary.

This procedure provides an easy way to format and view log files in Excel.

Go to TH2 Log File Viewing, also available from the Troubleshooting Procedure page.

This new troubleshooting item applies to all CTP output devices.

Go to The TH2 media slots are corrupted, also available from the Troubleshooting page under Firmware.

The document updates the difference between the P22 and P33 thermal imaging heads.

Go to P33 Kodak Thermal Imaging Head, also available from the P22 and P33 head identification page.

When the GMCE firmware installers fails, you can now perform a manual download to install the head firmware.

Go to GMCE Firmware Manual Loading Procedure. Also availabe from the Procedures page under Troubleshooting Procedures.

TH2 head firmware version 1.08j replaces previous version 1.08i. This patch addresses the previous focus learn failures.

Go to Thermal 2 Head Firmware Release Summary.

New photos are now available.

Go to the Drawings/photos page.

The head adjustment to correct tilt has been revised.

Go to Adjusting Tilt on a Thermal Head, also available from the Procedures page.

Thermal 2 Head firmware versions 1.09c, 1.08i, 1.07b, and 1.06. now include PostDowngrade101i.spt.

Go to Thermal 2 Head Firmware Release Summary.

The procedure for installing TH2s on Trendsetters has been updated. Go to TH2 Installation Procedure for Trendsetter Platesetters. It now includes actions related to FCO E040 and a reference to the Adjusting Tilt on a Thermal Head Procedure.

The following TH2 Script Help files have been updated with added information and sample results:

• BeamBalance.spt
• BPMeasure.spt
• ContvBP.spt
• ContvHV.spt
• FocusPi.spt

Always use controlled releases to install version 1.09c head firmware. This ensures that the firmware is only installed on devices that support it.

The highlights of this release include:

• Added plot tracking parameters
• Increased the beam balance timeout to allow time for the secondary beam balance (introduced in V1.07)
• Introduced error [00230] to separate maximum error and MAE failures
• Moved automatic gain control (AGC) parameters from FOC to MED
• Added support for Magnus VLF CR4.2

Go to the TH2 FW V1.09c page. Also see the TH2 Firmware Release Overview.

If you are implementing FCO 12621, make sure that you drain the ethylene glycol from the thermal head before you introduce the new propylene glycol.

Go to FCO CA12621 and Draining the Coolant from a TH1 or TH2 Head.

If the final window is loose, has fallen out, or is scratched, it must be replaced.

Go to TH2 window is loose or falls out and Replacing the TH2 Window (30-1139D screw style).

The laser safety course Laser Safety: Mastering Light is now available for all Kodak employees.

Go to the Laser Safety page.

The lenticular printing specification of 1.5 microns has been added to this procedure.

Go to Adjusting Tilt on a Thermal Head, also available from the Procedures page.

Go to Jitter artifact on lenticular applications, also available from the Artifact gallery (artifact 0020).

This document provides a summary of the release notes from all known good TH2 firmware releases. If you are using a firmware build that is not listed in this document, upgrade to the latest controlled release.

Go to the TH2 Firmware Release Overview, or the Firmware Release page.

Using a TH2 head firmware version earlier than 1.05d can shorten the life of the head.

• If you must downgrade, always use the latest known good revision of the desired firmware version. For example, if you need to downgrade to version 1.04, use 1.04d, not 1.04c.
• If you must downgrade to a version earlier than 1.05d, plan an upgrade of the device to the latest Controlled Release. This will extend the life of the thermal head.

For details on the latest firmware release, go to the Firmware Release page.

This new troubleshooting item applies to all CTP output devices.

Go to Irregular artifact lines in the mainscan direction, also available from the Artifact gallery.

If you try to connect a cable when the pins are not properly aligned, you may damage the connector and the pins. This can cause intermittent communication, lvd data, or safety loop errors.

The military connectors should seat easily and evenly. If this is not the case, do not force the connector on.

Go to Always check the pin alignment before connecting the control cable. If you suspect that the pins are damaged, go to Intermittent communication, lvd data, or safety loop errors.

When you return a TH2 head, make sure that you remove the small whisker jet block or debris nozzle before you ship the head. The block or nozzle must remain with the device so that it can be re-installed on the new head.

If you forget to remove the whisker jet block or debris nozzle, make sure you order a new one for the replacement head. Use the following part numbers:

• Whisker Jet block: 57-7501A
• Debris nozzle kit: 50-2331A

Go to Remove the whisker jet block before shipping a TH2 head. For a full listing of nozzle parts, Go to Debris Removal Nozzles.

Use this procedure to assess the health of the major components of a thermal 2 head. Download the procedure here TH2 General Health Procedure or from the Procedures page under Troubleshooting procedures.

A new document is available that describes the functionality of all available scripts for Thermal 1 (TH1), Thermal 2 (TH2), and Thermal 3 (TH3).

Download the index here: Script Index: TH1, TH2, and TH3. It is also available from the Reference page of this site.

For a general guideline on how to troubleshoot the head, see How to troubleshoot a TH2 head. This approach works well with the new organization of the Troubleshooting page.

The content on the Procedures page and the Troubleshooting page has been reviewed and reorganized to better reflect your needs. Please share your feedback with Kyle Good or Maureen Munroe.

• Procedures
• Troubleshooting

Some TH2-related device nvs parameters have been added to the TH2 Control-Settings page.

• TH2-related Device NVS Parameters: GMCE and MCE
• TH2-related Device NVS Parameters: MPE

This procedure now includes more detailed descriptions of the pin-outs in the power and signal connectors. For full details, see Appendix A.

Download the document here: Measuring Voltages on a TH2 head.

Previously, you had to go to two different places to find information on TH2 error codes. Now, all the information is located in one place. This includes basic error code information as well as any troubleshooting procedures.

The error codes are available in the drop-down menu on the Troubleshooting page, or you can browse alphabetically or by subsystem. See the following links.

• Error codes: drop-down menu
• By Subsystem: Error Code List - Field Access
• By Subsystem: Error Code List - Engineer Access
• Alphabetical Error Code List - Field Access
• Alphabetical Error Code List - Engineer Access

Always use controlled releases to install version 1.08i head firmware. This ensures that the firmware is only installed on devices that support it.

Three new features were added, and four problems were fixed. The highlights include:

• Display humidity as a percentage
• Prevent laser unstable errors during laser calibration
• Limit clamp time for devices with large clamp regions
• Laser error 2341 is now a fatal error that causes the plot to abort

For full details on these and other features, see the 1.08i head firmware release notes, posted on the TH2 firmware summary page.

Swath-bound clouds or blotches and/or tick marks appear on the plate. It can be described at first glance as banding or blotchy solids. It is most visible in solids on devices running at high speeds and with high powers.

For full details on how to troubleshoot this artifact, see Cloud or blotch-shaped artifacts appear in solids.

For full details on how to troubleshoot this error, see The M8 sensor is saturated.